There has been much technological advancement in products such as Semiconductor chip, FPD (Flat Panel Display), Solar panel and Cell phone. For the Semiconductor chip, miniaturization has led to circuit linewidth design decreasing from 32 nm to 22 nm, and large scale integration allows change from single to multiple packaging design (System in Package) which accomplish lower power consumption, higher operating speed and smaller chip size. For the FPD, the panel size has been increased to 2850mm x 3050mm (10th generation) from 2500mm x 2300mm (8th generation). Due to advancement and industry trend in Semiconductor or FPD manufacturing equipment, the components such as Bearing, Linear motion products and Mechatronics products are required to obtain lower dust emission, lower out gas, higher thermal resistance, better corrosion resistance, higher rigidity, higher speed and higher accuracy.

Semiconductors  bearing Application:

Inspection equipment

Wafer probers

Sputtering equipment

Wafer transfer systems

Dispensing

Pick and place robotics

Measuring systems

Test head

Positioners

Dicing equipment

Lapping equipment

Vacuum deposition systems

Wafer steppers

Probe stations

Arms

Wafer trimmers

Wafer scrubbers

Wafer polishers

Thin-film deposition systems

CVD systems

Etching systems

Mechanical polishers

Atmospheric & vacuum transfer

Robots

Test heads

Manipulators

Megasonic cleaning systems

Spin dryers

Photolithography

Mechanical polishers

Die bonders